CHARACTERISTICS
特性

UNIT
單位

CONDITIONING
條件

TYPICAL VALUE
常規值

SPEC.
參數

Volume resistivity
體積電阻

MΩ-cm

C-96/35/90

5.0X109

106↑

Surface resistivity
表面電阻

MΩ

C-96/35/90

5.0X107

104↑

Permittivity 1MHZ
電容率

-

C-24/23/50

4.2-4.4

5.4↓

Permittivity 1GHZ
電容率

-

C-24/23/50

3.8-4.0

-

Loss Tangent 1MHZ
介質損耗角正切

-

D-24/23/50

0.015-0.020

0.035↓

Loss Tangent 1GHZ
介質損耗角正切

-

D-24/23/50

0.012-0.014

-

Arc resistance
耐電弧性

SEC

D-48/50
+D-0.5/23

120↑

60↑

Dielectric breakdown
節電擊穿

KV

D-48/50

60↑

40↑

Moisture absorption
吸濕性

%

D-24/23

0.2-0.3

0.35↓

Flammability
可燃性

-

C-48/23/50

94V0

94V0

Peel strength 1oz
抗剝離強度

lb/in

288℃ x 10″
solder floating
浮焊

10-14

6↑

Thermal Stress
熱應力

SEC

288℃
solder dipping
浸焊

90↑

10↑

Dimensional stability
X-Y axis
XY軸尺寸穩定性

%

E4/105

0.01-0.03

0.050↓

Glass transition temperature
玻璃轉化溫度

℃

DSC

140±5

N/A

Co-efficiency of thermal expansion
熱膨脹係數

Z-axis before Tg
Tg前 Z軸膨脹係數

ppm/℃

TMA

50-70

N/A

Z-axis After Tg
Tg後Z軸膨脹係數

ppm/℃

TMA

250-350