本品有如下特徵：玻璃轉化溫度150±5 ℃；低粉塵且符合無鹵產品標準；優越的絕緣和機械加工性能；阻燃等級符合UL 94 V-0標準；本品顏色為淡黃色
This series of products present the following features; Tg point: 150±5 ℃; Low Dust and Meets halogen-free requirements; Excellent insulation and mechanic process performance; Flammability meets UL 94 V-0; Light yellow Appearance
CHARACTERISTICS 特性 | UNIT 單位 | CONDITIONING 條件 | TYPICAL VALUE 常規值 | SPEC. 參數 | ||
Volume resistivity 體積電阻 | MΩ-cm | C-96/35/90 | 5.0X108-5.0X109 | 106↑ | ||
Surface resistivity 表面電阻 | MΩ | C-96/35/90 | 5.0X106-5.0X107 | 104↑ | ||
Permittivity 1MHZ 電容率 | - | C-24/23/50 | 4.6-4.8 | 5.4↓ | ||
Permittivity 1GHZ 電容率 | - | C-24/23/50 | 4.1-4.3 | - | ||
Loss Tangent 1MHZ 介質損耗角正切 | - | D-24/23/50 | 0.014-0.016 | 0.035↓ | ||
Loss Tangent 81GHZ 介質損耗角正切 | - | D-24/23/50 | 0.012-0.014 | - | ||
Arc 4.13resistance 耐電弧性 | SEC | D-48/50 +D-0.5/23 | 120↑ | 60↑ | ||
Dielectric breakdown 節電擊穿 | KV | D-48/50 | 60↑ | 40↑ | ||
Moisture absorption 吸濕性 | % | D-24/23 | 0.05-0.1 | 0.35↓ | ||
Flammability 可燃性 | - | C-48/23/50 | 94V0 | 94V0 | ||
Peel strength 1oz 抗剝離強度 | lb/in | 288℃ x 10″ solder floating 浮焊 | 7-9 | 6↑ | ||
Thermal Stress 熱應力 | SEC | 288℃ solder dipping 浸焊 | 200↑ | 10↑ | ||
Dimensional stability X-Y axis XY軸尺寸穩定性 | % | E-0.5/170 | 0.005-0.03 | 0.050↓ | ||
Glass transition temperature 玻璃轉化溫度 | ℃ | DSC | 150±5 | N/A | ||
Flexural Strength 撓曲強度 | LW | N/mm2 | A | 430-500 | 415↑ | |
GW | N/mm2 | A | 350-420 | 345↑ | ||
Co-efficiency of thermal expansion 熱膨脹係數 | ||||||
X-Y axis XY軸膨脹係數 | ppm/℃ | TMA | 9-13 | N/A | ||
Z-axis before Tg Tg前 Z軸膨脹係數 | ppm/℃ | TMA | 30-50 | N/A | ||
Z-axis After Tg Tg後Z軸膨脹係數 | ppm/℃ | TMA | 200-230 | N/A | ||
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