本品有如下特徵:玻璃轉化溫度150±5 ℃;符合無鹵無鉛產品標準;本品顏色為淡黃色;優越的絕緣性能和熱傳導性;阻燃等級符合UL 94 V-0標準
This series of products present the following features; Tg point: 150±5 ℃; Meets lead-free & Halogen-free product requirements; Light Yellow Appearance; Excellent insulation performance and heat conductivity flammability meets UL 94 V-0
CHARACTERISTICS 特性 | UNIT 單位 | CONDITIONING 條件 | TYPICAL VALUE 常規值 | SPEC. 參數 |
Volume resistivity 體積電阻 | MΩ-cm | C-96/35/90 | 5.0X109 | 106↑ |
Surface resistivity 表面電阻 | MΩ | C-96/35/90 | 5.0X107 | 104↑ |
Permittivity 1MHZ 電容率 | - | C-24/23/50 | 4.2-4.4 | 5.4↓ |
Permittivity 1GHZ 電容率 | - | C-24/23/50 | 3.8-4.0 | - |
Loss Tangent 1MHZ 介質損耗角正切 | - | C-24/23/50 | 0.013-0.015 | 0.035↓ |
Loss Tangent 1GHZ 介質損耗角正切 | - | C-24/23/50 | 0.011-0.013 | - |
Arc resistance 耐電弧性 | SEC | D-48/50 +D-0.5/23 | 120↑ | 60↑ |
Dielectric breakdown 節電擊穿 | KV | D-48/50 | 60↑ | 40↑ |
Moisture absorption 吸濕性 | % | D-24/23 | 0.2-0.3 | 0.35↓ |
Flammability 可燃性 | - | C-48/23/50 | 94V0 | 94V0 |
Peel strength 1oz 抗剝離強度 | lb/in | 288℃ x 10″ solder floating 浮焊 | 8-10 | 6↑ |
Thermal Stress 熱應力 | SEC | 288℃ solder dipping 浸焊 | 300↑ | 10↑ |
Dimensional stability X-Y axis XY軸尺寸穩定性 | % | E4/105 | 0.01-0.03 | 0.050↓ |
Glass transition temperature 玻璃轉化溫度 | ℃ | DSC | 150±5 | N/A |
Co-efficiency of thermal expansion 熱膨脹係數 | ||||
X-Y axis X-Y軸膨脹係數 | ppm/℃ | TMA | 9-13 | N/A |
Z-axis before Tg Tg前 Z軸膨脹係數 | ppm/℃ | TMA | 30-50 | N/A |
Z-axis After Tg Tg後Z軸膨脹係數 | ppm/℃ | TMA | 200-230 | N/A |